This group includes components and materials designed to manage heat dissipation and ensure efficient thermal management in electronic systems. Heat Sinks: Passive cooling solutions made of materials like aluminum or copper, designed to dissipate heat away from components such as processors, power transistors, and LEDs. Thermal Interface Materials (TIMs): Include thermal pads, pastes, and adhesives that improve heat transfer between components and heat sinks. Cooling Plates and Modules: Advanced solutions for high-power applications, providing efficient heat dissipation through liquid cooling or integrated systems. Thermal Insulation and Spacers: Protect components from heat while maintaining mechanical stability. These products are essential for maintaining system reliability, preventing overheating, and extending the lifespan of electronic devices in applications such as computing, automotive, and industrial systems.