BAG, STATSHIELD FOIL MBB, IPC/ JEDEC 4 MIL, 10INx20IN, 100/PK

• NEW IPC/JEDEC J-STD-033B Moisture Sensitive Caution Label Printed on Foil Moisture Barrier Bag¹

Identifies moisture sensitive devices for levels 2, 2a, 3, 4, 5, and 5a as defined by J-STD-020. Does not require additional labeling.

• Film Laminate Metal Layered 0.0040”  (4 mil) Thick Moisture Barrier Bag 

Designed for electrostatic discharge (ESD) shielding protection when dry packing components. Meets ANSI/ESD S20.20, ANSI/ESD SS41, and ANSI/ESD S11.4 Level 1.

• MVTR <0.0003 Grams per ASTM F1249-90² (Flex Testing per ASTM F392³)

Designed for dry packing of moisture sensitive devices and to protect contents from damage due to ESD events or EMI.

• Insulative Nylon Reinforcement Layer

Strengthens bag structure to maintain performance per ASTM F392 flex testing and meets the ANSI/ESD S541 requirement as a barrier to current flow.

• <10 nJ Energy Penetration Tested per ANSI/ESD STM11.31

Protects contents from ESD charges and discharges.

• >25lb Puncture Strength Average per FTMS 101C/4046

Provides physical protection for contents.

• Dissipative Inner and Outer Surfaces Rs 1 x 10⁴ to <10¹¹ ohms per ANSI/ESD STM11.11

Allows bag to be grounded when placed on a grounded surface

• Printed with ESD Protective Symbol and lot code information

Meets the requirements of ANSI/ESD S541 for quality control purposes.

• Lead-free RoHS 2 and REACH compliant
• Made in the United States of America

This item is made and stocked in

Canton, MA

from internationally sourced laminate film

¹Dry packaging for electronics requires three elements:

     Statshield® Moisture Barrier Bags – To Protect
     Desiccant – To Absorb Moisture
     Humidity Indicator Card – To Monitor Performance

For detailed instructions see Technical Bulletin TB-2031 – Moisture Barrier Bags Application Instructions.

²ASTM F1249-90 test method covers a procedure for determining the rate of water vapor transmission through flexible barrier materials.

³ASTM F392 (condition E) test method determines the resistance of flexible-packaging materials to flex-formed pinhole failures.